Custom Heat Sink-Zipper Fin Heat Sink
Zipper Fin Heat Sinks
A zipper fin heat sink, also known as a zipper fin or snapped fin heat sink, is an innovative cooling solution designed to dissipate heat efficiently from electronic components. Its unique construction involves interlocking fin structures resembling a zipper pattern. These fins are created by stamping or forming sheets of metal, often aluminum or copper, into a pattern that enhances the heat sink's surface area. This design optimizes air-flow, enabling improved heat transfer through convection. Zipper fin heat sinks are utilized in various applications, particularly in electronics, where they offer effective thermal management within confined spaces, contributing to enhanced performance and longevity of components.
| Material | copper/aluminum |
| Thickness | Based on your requirements. |
| Shapes | Based on your requirements. |
| Color | Based on your requirements. |
| Length | customized length |
| MOQ | Low MOQ |
| Application | Inverter / Inverter / Power / IGBT / Rectifier / LED Lighting / Welding Machine / Communication Equipment / Electronics Industry / Solid State Relay / Controller / Electromagnetic Heating |
| Deep process | CNC, drilling,milling,cutting,stamping,welding,bending,assembling,Custom Aluminum Fabrication |
| Finish | Anodizing, Mill finish, Electroplating, Polishing, Sand blasted, Powder coating, Silver plating, Brushed, Painted, PVDF, etc. |
| Certificate | CE/SGS/ISO/Rohs |
| Service | 1. Free sample, Free design. 2. OEM/ODM available. 3. Custom-made request. 4. New design solution suggestion. |
When seeking a premium zipper fin heat sink, Tone stands as your ideal destination. Tone boasts a range of production processes for crafting exceptional zipper fin heat sinks.
Parts of Our Products
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Thermal Design&Thermal Simulation
Our Workshop
send 3D and CAD drawing, confirm production details
confirm the order and start to make samples.
Customization Process
surface treatment confirmation.
send samples to confirm quality and product details
we send the quotation to your for review.
after sample is confirmed, we will start mass production
The Process of Heat Sink Production
Our Packaging
● Efficient Cooling in Vertical Orientation
● Aesthetic Appeal
● Versatility
● Improved Structural Integrity
If you're seeking a high-density cooling solution, our zipper fin heat sink is an excellent alternative to both skived and extrusion heat sinks. In contrast to a skived fin design, the Heatell zipper fin heat sink features a fin and base stack assembly that is securely bonded or soldered together.
Our zipper fin heat sink is crafted from a combination of aluminum, copper, and Inconel. These variants come with a choice of either nickel-plated or chromate finishes, dependent on the material employed. Our range includes diverse zipper styles for these heat sinks, including open, closed, and mixed configurations.
keep reading to learn more about stamping heat sink
A zipper fin heat sink is a specialized cooling component designed to dissipate heat from electronic devices and components. Its distinct design consists of interlocking fin structures that resemble a zipper pattern. These fins are typically made from materials like aluminum or copper. The unique arrangement of zipper fins serves to enhance the heat sink's surface area, promoting more efficient heat transfer through convection. This innovative design optimizes airflow, allowing cooler air to flow through the fins and carry away the heat generated by the components. Zipper fin heat sinks are particularly beneficial in applications with space constraints, as their compact yet effective design offers efficient thermal management.
What is Zipper Fin Heat Sink?
● Enhanced Heat Dissipation: The interlocking fin design provides a larger surface area, enabling efficient heat dissipation and improved thermal performance.
● Compact Form Factor: Zipper fins allow effective cooling in confined spaces, making them ideal for applications with limited room for cooling solutions.
● Optimized Airflow: The unique zipper fin pattern promotes better airflow, leading to enhanced convection currents that facilitate faster heat transfer and cooling.
● Customization Options: Zipper fin heat sinks can be customized in terms of material choice, fin dimensions, and spacing, catering to specific cooling requirements and device characteristics.
● Improved Structural Integrity: The interlocking design enhances overall strength and rigidity, contributing to the heat sink's durability and resistance to mechanical stress.
● Versatility: These heat sinks can be adapted for various industries and applications due to their efficient cooling capabilities and flexible design.
● Efficient Cooling in Vertical Orientation: The vertical arrangement of zipper fins ensures effective heat
dissipation even in systems with vertically mounted components.
● Aesthetic Appeal: The distinctive zipper fin pattern adds a unique visual element to devices or systems, enhancing their design aesthetics.
● Suitable for High-Density Applications: Zipper fin heat sinks are well-suited for high-density electronics
where space-efficient cooling solutions are essential.
● Stable Bonding: The fin and base stack assembly in zipper fin heat sinks is securely bonded or soldered, contributing to their reliability and consistent performance.
Advantages of Zipper Fin Heat Sink?
Base Dimensions: The base dimensions determine the area of contact between the heat sink and the component it's cooling. The base should be large enough to cover the entire heat-generating area of the component.
● Fin Height: The height of the fins impacts the overall surface area available for heat dissipation. Taller fins generally offer better heat dissipation, but there's a trade-off between fin height and the space available in the device. Additionally, taller fins can create more airflow resistance, potentially affecting the overall cooling efficiency.
● Fin Thickness: Fin thickness affects both heat conduction and airflow resistance. Thicker fins can conduct heat more effectively, but thinner fins allow for better airflow between the fins.
● Fin Pitch: Fin pitch refers to the distance between adjacent fins. A smaller fin pitch increases the total surface area, aiding in better heat dissipation. However, too small a pitch might restrict airflow and increase pressure drop, reducing overall cooling efficiency.
● Number of Fins: The number of fins on the heat sink influences the total surface area available for heat exchange. More fins generally result in better heat dissipation, but there's a practical limit depending on the available space and the airflow conditions.
● Fin Material and Thermal Conductivity: The material of the fins impacts heat conductivity. Common materials include aluminum and copper. Copper has higher thermal conductivity but is also more expensive. The choice of material should consider both thermal performance and cost.
● Base Thickness: Thicker bases can help distribute heat more evenly across the fins, but they can also add weight and potentially hinder heat transfer if the base material has lower thermal conductivity.
● Attachment Mechanism: Consider the method by which the heat sink will be attached to the component. This could involve clips, screws, adhesive thermal pads, or other mechanisms. The attachment method can affect overall dimensions and ease of installation.
● Airflow Conditions: The airflow within the system or device plays a significant role in heat dissipation. Ensure that the dimensions of the heat sink are compatible with the available airflow to avoid creating bottlenecks or dead zones.
● Overall Form Factor: The final dimensions of the heat sink should fit within the available space in the device without causing interference with other components.
When designing or selecting a zipper fin heat sink, it's essential to balance these dimensions and factors to achieve the optimal cooling performance for your specific application. Thermal simulations and testing can help refine your design and ensure that the heat sink effectively dissipates the heat generated by the components.
Appropriate Dimensions for Zipper Fin Heat Sinks
Suitable Thickness For Zipper Fin Heat Sink
The suitable thickness for a zipper fin heat sink depends on factors like the material's thermal conductivity, required heat dissipation, available space, and airflow conditions. Thicker heat sinks can offer more surface area for heat transfer but might obstruct airflow and add weight, while thinner ones could lead to insufficient cooling. Balancing these considerations is crucial to achieve optimal thermal performance and fit within the design constraints of the system.
Using thinner fins is recommended, as they enhance efficiency, performance, and heat dissipation. While certain applications may demand thicker fins, others benefit from thinner ones. The recommended optimal thickness typically falls within the range of 0.4mm to 2mm.
Typically, the 6000 series is commonly acknowledged as the most fitting choice of aluminum alloy for zipper-style heat sinks. Within the 6000 series, these aluminum alloys display impressive thermal conductivity ranging from 166 to 201 (W/m•K), making them highly suitable for optimal heat sink performance in this application.
In sammery，the choice of aluminum alloy for manufacturing zipper fin heat sinks depends on factors such as thermal conductivity, mechanical properties, cost, and ease of manufacturing.
Ideal Aluminum Alloy For Zipper Fin Heat Sink Manufacture Procedure
● Computers and Servers: Zipper fin heat sinks are commonly used in CPUs (Central Processing Units), GPUs (Graphics Processing Units), and other high-performance computing components to manage heat and prevent overheating.
● LED Lighting: Light-emitting diodes (LEDs) generate heat, which can affect their performance and lifespan. Zipper fin heat sinks are employed to maintain optimal operating temperatures in LED lights, ensuring longer life and consistent brightness.
● Power Electronics: Power modules, inverters, and converters in applications such as motor drives, renewable energy systems, and industrial automation generate substantial heat. Zipper fin heat sinks are used to manage and dissipate this heat efficiently.
● Automotive Electronics: In vehicles, electronics like power modules, sensors, and control units generate heat. Zipper fin heat sinks play a crucial role in preventing thermal damage and maintaining reliable performance.
● Telecommunications Equipment: Networking equipment, routers, and switches produce heat due to their continuous operation. Zipper fin heat sinks aid in maintaining proper thermal management and system stability.
● Consumer Electronics: Devices like laptops, gaming consoles, and audio amplifiers benefit from zipper fin heat sinks to prevent heat-related performance degradation and extend component lifespans.
● Medical Devices: Medical equipment like imaging devices, laboratory instruments, and diagnostic tools often require efficient heat dissipation to ensure accurate and reliable performance.
● Automotive Cooling: In addition to electronics, zipper fin heat sinks are also used for cooling various automotive components, such as transmission systems and engine control units, to enhance overall vehicle efficiency.
● Industrial Equipment: Various industrial machinery, including welding equipment, CNC machines, and process control systems, generate heat during operation. Zipper fin heat sinks aid in maintaining safe operating temperatures.
● Aerospace and Defense: Electronic systems within aircraft, satellites, and military equipment are subject to extreme temperature fluctuations. Zipper fin heat sinks contribute to thermal stability and reliability in these applications.
Application of Zipper Fin Heat Sinks
Choosing the suitable zipper fin heat sink for your application involves considering various factors to ensure effective heat dissipation and optimal thermal performance. Here's a step-by-step guide:
● Heat Dissipation Requirements: Determine the amount of heat that needs to be dissipated by the heat sink. This information will help you select a heat sink with an appropriate surface area and thermal conductivity.
● Component and Space Constraints: Evaluate the size and shape of the component that requires cooling. Consider the available space within the device or system where the heat sink will be installed.
● Thermal Conductivity of Material: Different materials have varying thermal conductivity. Choose a material, such as aluminum or copper, that offers the required level of heat transfer efficiency for your application.
● Fin Dimensions: Select the fin height, thickness, and pitch based on your specific heat dissipation needs and airflow conditions. Taller fins provide more surface area, but be mindful of potential airflow restrictions.
● Attachment Method: Determine how the heat sink will be attached to the component. Consider options like clips, screws, adhesive thermal pads, or other methods. The attachment method should be secure and compatible with your application.
● Airflow Conditions: Analyze the airflow conditions within the device or system. Ensure that the chosen heat sink design allows for proper airflow between the fins to prevent airflow bottlenecks.
● Material and Manufacturing: Choose an aluminum alloy that suits your application's needs. The 6000 series is often preferred. Consider manufacturing processes such as extrusion, stamping, or forging, based on your design requirements.
● Thermal Simulation and Testing: Utilize thermal simulation software or conduct testing to assess how the chosen heat sink design performs in your specific application. This can help you refine the design and make informed decisions.
● Environmental Considerations: If your application is exposed to harsh environments, consider factors like corrosion resistance and durability when selecting the heat sink material and finish.
● Cost Considerations: Evaluate the cost-effectiveness of the heat sink solution, considering factors such as material cost, manufacturing complexity, and overall system budget.
● Vendor and Customization: Choose a reputable heat sink manufacturer or supplier who can provide customizable solutions that meet your exact requirements.
● Regulatory and Safety Compliance: Ensure that the selected heat sink complies with any relevant industry standards or regulations, especially in sensitive applications like medical or aerospace.
● Future Scalability: Consider whether the chosen heat sink design can accommodate future changes in the application's heat dissipation requirements or any potential component upgrades.